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Title

HYBRID ELECTROSTATIC AND MICRO-STRUCTURED ADHESIVES FOR ROBOTIC APPLICATIONS

Creator

Ruffatto, Donald F., Iii

Date

2015, 2015-07

Description

Current adhesives and gripping mechanisms used in many robotics applica- tions function on very speci c surface types or at de ned attachment...
Show moreCurrent adhesives and gripping mechanisms used in many robotics applica- tions function on very speci c surface types or at de ned attachment locations. A controllable, i.e. ON-OFF, adhesive mechanism that can operate on a wide range of surfaces would be very advantageous. Such a device would have applications ranging from robotic gripping and climbing to satellite docking and inspection/service mis- sions. The main goal of the research presented here was to create such an attachment mechanism through the use of a new hybrid adhesive technology. The newly devel- oped adhesive technology is a hybridization of electrostatic and micro-structured dry adhesion. The result provides enhanced robustness and utility, particularly on rough surfaces. There were challenges not only in the integration of these two adhesive elements but also with its application in a complete gripping mechanism. Electrostatic and directional dry adhesives were both individually investigated. The electrode geometry for an electrostatic adhesive was optimized for maximum ad- hesion force using nite element analysis software. Optimization results were then veri ed through experimental testing. New manufacturing techniques were also de- veloped for electrostatic adhesives that utilized a metalized mesh embedded in a sili- cone polymer and Kapton lm based construction, greatly improving adhesion. The micro-structured dry adhesive used was provided by Dr. Parness, from the NASA Jet Propulsion Lab (JPL), and consists of an array of vertical stalks with an angled front face, referred to as micro-wedges. The hybrid electrostatic dry adhesive (EDA) was created by fabricating the electrostatic adhesive directly on top of a dry adhesive mold. This process created an array of dry adhesive micro-wedges directly on the surface of the electrostatic adhesive. In operation the electrostatic adhesive provides a normal force which serves to pull the dry adhesive into the surface substrate. With greater surface contact more of the dry adhesive is able to engage, bring the electro-static adhesive even closer to the surface and increasing its e ectiveness. Therefore, the combination of these two technologies creates a positive feedback cycle whose whole is often greater than the sum of its parts. An interface mechanism is needed to transmit applied loads from a rigid struc- ture to the exiable adhesive while still maintaining its conformability. This is es- pecially important for strong adhesion on rough surfaces, such as tile and drywall. Di erent concepts such as a structured brillar hierarchy and a uid- lled backing pouch have been explored. Additionally, nite element analysis was used to evaluate di erent fribrillar shapes and geometry for the structured hierarchy. The goal was to equalize the load distribution across the adhesive while still maintaining surface compliance. A gripper mechanism was also created which used a servo for actuation and three rigid tiles with a directional dry adhesive. It was tested on a perching Micro Air Vehicle (MAV) as well as in the RoboDome facility at NASA's Jet Propulsion lab to simulate a satellite docking/capture maneuver.
Ph.D. in Mechanical and Aerospace Engineering, July 2015
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