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DEVELOPMENT OF ADVANCED PACKAGING, FABRICATION AND RELIABILITY METHODS FOR SUBMINIATURE IMPLANTABLE NEURAL PROSTHESES
Title
DEVELOPMENT OF ADVANCED PACKAGING, FABRICATION AND RELIABILITY METHODS FOR SUBMINIATURE IMPLANTABLE NEURAL PROSTHESES
Creator
Kim, Taehyung
Date
2011-08, 2011-07
Description
The main purpose of the present thesis is to study the critical reliability issues of polymeric encapsulated electronic devices for visual...
Show moreThe main purpose of the present thesis is to study the critical reliability issues of polymeric encapsulated electronic devices for visual prosthesis. Visual prosthesis has been compatibly studied over twenty years in many professional research labs. The electric design of circuit for the visual prosthesis has been well studied so far. However, the device packaging design and reliability have been not studied extensively. In particular, failure analysis and reliability using non-hermetic packaging for long lifetime visual prosthesis have been poorly studied. The first step of the research for this thesis was to create a mechanical design of a visual prosthesis prototype. The prototype device was created by fabricate a multi-layer structure consisting of electrodes, substrate, and integrated circuit chip with silicone encapsulated packaging. The interconnection between the chip and electrodes used Au wire and Al bonding pad. The prototype devices were tested in a liquid water. This water environment is not a common reliability test for commercial electronic packaging. Relative humidity testing is a common and widely used testing methods, but the visual prosthesis device cannot be applied to gas phase relative humidity testing due to the environment condition. Water absorption in polymeric material in the liquid water is higher than in the vapor water. After water penetrated interconnection interface, the Au-Al intermetallic compound becomes oxidized and generates bonding die open failure. From these unusual testing results, we were conformed the failure mechanism and predicted the lifetime using Au-Al imtermetallic growth pattern and oxidation. Additional discussions include transition metal ions in CSF to expect the other failure mechanisms. Wafer and packaging level xiii failure mechanisms by Cu and Fe ions are also discussed in this thesis. The end of this thesis discuss possible fabrication processing to protect overall external environment effects for polymeric packaging visual prosthesis. Overall this thesis study, which uses polymeric packaging electronic devices for bio-implant research, concluded that devices may not make good reliability devices in the CSF environment. The corrosion, oxidation and metallization on or in metal surfaces and interconnection interfaces should continually be studied to produce longer lasting electronic devices over 30 years. The reliability of the visual prosthesis has not been well studied in any other professional research labs, so this thesis may give or address some initial guidelines to help save time for the project decision in the future to develop advanced hermetic packaging for bioimplantable electronic devices.
Ph.D. in Materials Science and Engineering, July 2011
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