<?xml version="1.0"?>
<mods xmlns="http://www.loc.gov/mods/v3" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:xlink="http://www.w3.org/1999/xlink" version="3.7" xsi:schemaLocation="http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-7.xsd">
  <titleInfo>
    <title>Two-phase Heat Transport Device using Electrohydrodynamic Conduction Pumping</title>
  </titleInfo>
  <name>
    <role>
      <roleTerm type="text" authority="marcrelator" authorityURI="http://id.loc.gov/vocabulary/relators" valueURI="http://id.loc.gov/vocabulary/relators/cre">creator</roleTerm>
    </role>
    <namePart>Yagoobi, Jamal Seyed</namePart>
  </name>
  <name>
    <role>
      <roleTerm type="text" authority="marcrelator" authorityURI="http://id.loc.gov/vocabulary/relators" valueURI="http://id.loc.gov/vocabulary/relators/cre">creator</roleTerm>
    </role>
    <namePart>Pearson, Matthew R.</namePart>
  </name>
  <abstract>An electrohydrodynamic conduction liquid pumping system having a vessel configured to contain a liquid therein, a single pair or multi-pairs of electrodes disposed in a circularly spaced apart relationship to each other inside the vessel and configured to be oriented in the liquid. A power supply is coupled to the electrodes and configured to generate electric fields in-between each electrode pair to induce a net radial pumping of the liquid. A heat source is provided to produce heat sufficient to boil and vaporize the liquid while non-vaporized liquid moving toward the heat source prevents over-heating of the heat source. A heat sink is configured to have a operating temperature below the vaporization temperature of the liquid so that contact of the vapor with the heat sink will condense the vapor into a liquid to replenish the liquid supply moving toward the heat source.</abstract>
  <note type="provenance">Submitted by Aric Ahrens (ahrens@iit.edu) on 2013-10-30T17:02:02Z No. of bitstreams: 2 license_rdf: 1089 bytes, checksum: 0a703d871bf062c5fdc7850b1496693b (MD5) 8568106.pdf: 80350 bytes, checksum: 19cc02c8da86bcb186eec23cfc7b1485 (MD5)</note>
  <note type="provenance">Made available in DSpace on 2013-10-30T17:02:02Z (GMT). No. of bitstreams: 2 license_rdf: 1089 bytes, checksum: 0a703d871bf062c5fdc7850b1496693b (MD5) 8568106.pdf: 80350 bytes, checksum: 19cc02c8da86bcb186eec23cfc7b1485 (MD5) Previous issue date: 2013-10-29</note>
  <note type="funding">Illinois Institute of Technology</note>
  <originInfo>
    <dateCaptured>2013-10-30</dateCaptured>
  </originInfo>
  <originInfo>
    <dateCreated keyDate="yes">2013-10-29</dateCreated>
  </originInfo>
  <identifier type="pn">8,568,106</identifier>
  <identifier type="hdl">http://hdl.handle.net/10560/3108</identifier>
  <language>
    <languageTerm type="code" authority="rfc3066">en</languageTerm>
  </language>
  <accessCondition type="useAndReproduction" displayLabel="cc">CC0 1.0 Universal</accessCondition>
  <accessCondition type="useAndReproduction" displayLabel="ccURI">http://creativecommons.org/publicdomain/zero/1.0/</accessCondition>
  <abstract>United States Patent</abstract>
  <abstract>Primary US Patent Classification 417/48</abstract>
  <abstract>US Patent Classification 361/700</abstract>
  <abstract>US Patent Classification 361/702</abstract>
  <abstract>International Patent Classification F04B 37/00</abstract>
  <abstract>International Patent Classification H05K 7/20</abstract>
  <typeOfResource authority="gmgpc" valueURI="http://id.loc.gov/vocabulary/graphicMaterials/tgm007520">Patent</typeOfResource>
  <physicalDescription>
    <digitalOrigin>reformatted digital</digitalOrigin>
    <internetMediaType>application/pdf</internetMediaType>
  </physicalDescription>
  <accessCondition type="useAndReproduction" displayLabel="rightsstatements.org">No Copyright - United States</accessCondition>
  <accessCondition type="useAndReproduction" displayLabel="rightsstatements.orgURI">http://rightsstatements.org/page/NoC-US/1.0/</accessCondition>
  <accessCondition type="restrictionOnAccess">Open Access</accessCondition>
</mods>
